This is our typical spec, It has worked for us. of course we don't do this 
much.

Notes, unless otherwise specified:

1.  Material: FR4 IPC 4101/24 0.062 thick or Equivalent
    copper; outer layers - 1 oz. plated up to 2 oz. finished
	    inner layers - 1 oz.
    four layer 94V-0 UL certified
2.  Immersion: ENIG (Electroless Nickel, Immersion Gold)
3.  Hole sizes specified are after plating - OK for Via holes to plug
4.  Solder Mask Over Bare Copper
5.  Solder mask: LPI (liquid photoimageable) Green Gloss - Matte Ok
6.  Tolerance: ±0.005
7.  Silk-screen ID (white)
8.  Bow and Twist: 1.5%
9.  Slot dimensions are outside of radius to outside of radius
10. Solder mask entire panel
11. Scoring: 20mil web
12. Misc. routes are 0.1 inches wide

CARD EDGE FINGERS:
GOLD TIPS - min. 30 microinches hard gold over 100-150 microinches
	      of nickel

Ray Johnston
Lead CAD Designer
Rane Corporation
425-355-6000
rayj@rane,com

----- Original Message ----- 
From: "Dave Schaefer" <[log in to unmask]>
To: <[log in to unmask]>
Sent: Tuesday, June 16, 2009 2:05 PM
Subject: [DC] Gold Fingers - ENIG or Hard Gold


Have a product that would be considered low insertion cycle that makes
connection to a back panel via "gold finger" edge connection.

I would prefer to specify ENIG finish for the entire PCB.

Is ENIG suitable for this application, or is Hard Gold required?

Are there any specifications which outline the requirement?

Thanks,
Dave

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