Good point Syed,
How about adding 'Molding' to differentiate from 'Potting' [and I just know
I will take heat for this] on the basis that when 'molded', the component
generally does not take the mold-form with itself in its finished state,
whereas if potted - the 'mold/pot' becomes part of the finished assembly.
Steve
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Syed Ahmad
Sent: Friday, June 05, 2009 11:27 AM
To: [log in to unmask]
Subject: Re: [TN] Coating, Encapsulation, and Potting
So the chip "encapsulation" to make a semiconductor package is actually
potting as the material is forced into a cavity around the chip?
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of John Burke
Sent: Thursday, June 04, 2009 11:46 PM
To: [log in to unmask]
Subject: Re: [TN] Coating, Encapsulation, and Potting
Very good
So a definition might be:
Encapsulation: covering with a material which conforms to the general shape
of the surface being coated and the plane on which it is situated but such
material is not otherwise bounded in 2 or 3 dimensions.
Potting: covering with a material which completely covers the item being
treated; and which material takes the shape of and is bounded in 2 or 3
dimensions by the shape of the container in which the item being treated is
situated.
John Burke
(408) 515 4992
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Woolley, Mark D. (Mark)
Sent: Thursday, June 04, 2009 4:31 PM
To: [log in to unmask]
Subject: Re: [TN] Coating, Encapsulation, and Potting
Can it be defined by geometry?
If you fill a box it's called potting, but if you coat an item is called
encapsulation?
mark
mark
Mark Woolley |PTRL Laboratory | Avaya | 1300 West 120th Ave |
Westminster, CO 80234 USA |email: [log in to unmask] |
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Joe Fjelstad
Sent: Thursday, June 04, 2009 1:04 PM
To: [log in to unmask]
Subject: Re: [TN] Coating, Encapsulation, and Potting
Interesting question Doug
1) My mental image is that it is that the term is related to processing
and potting is most often done atmospherically, with occasional vacuum
assist
and encapsulation under pressure but it is pretty fungible with lots of
fuzziness between the two. A potted assembly is definitely encapsulated
when
finished.
2) Likely? Yes but don't know where
3) Thickness of the coating seems reasonable but don't know where to
draw
the line. 250 micron? 100? 500? Perhaps a percentage of total
thickness?
5%? 10%?
4) In neither (or both depending on process). The other two generally
provide complete coverage of the device or assembly underfill is by
definition
partial.
Joe
In a message dated 6/4/2009 11:33:27 A.M. Pacific Daylight Time,
[log in to unmask] writes:
Good afternoon all,
All this talk of underfill sparked a reminder of an IPC action item of
mine. Unknownst to most of you , I signed you all up on some of my
committees. There will be a new task group addressing potting and
encapsulation, which will meet at the Fall IPC. We already have
conformal
coat task groups.
So, I wish to initiate a series of questions and illuminating debate.
Pardon me if I fall short on the illumination part (leave it alone
Dewey).
1. What would you consider to be a definition of "potting" and a
definition of "encapsulation"?
2. Are there standard definitions for these somewhere? They don't
exist
in IPC as far as I know.
3. What would you consider to be the boundary between conformal
coating
and "potting or encapsulation"? I have my own opinions but want to
hear
yours.
4. In what class would you consider an underfill to be in?
That's enough homework for now.
Doug Pauls
Rockwell Collins
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