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Thanks everyone for the excellent feedback. Interesting information. Regards
Steve Kelly
From: [log in to unmask] [mailto:[log in to unmask]]
Sent: June-03-09 2:50 PM
To: Steve Kelly
Subject: Re: [TN] BGA-113 package
Hi Steve! Yes, you can reflow a BGA with "flux only" and not use
solderpaste. Just remember that solder joint integrity is a function of the
solder joint height. A BGA reflowed with "flux only" will have lower solder
joint life than a BGA reflowed with solderpaste. And lower life doesn't not
necessarily mean bad - just lower. The resulting BGA solder joints may be
perfectly acceptable for the product use environment. Good Luck.
Dave Hillman
Rockwell Collins
[log in to unmask]
Steve Kelly <[log in to unmask]>
Sent by: TechNet <[log in to unmask]>
06/03/2009 11:10 AM
Please respond to
TechNet E-Mail Forum <[log in to unmask]>; Please respond to
Steve Kelly <[log in to unmask]>
To
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Subject
[TN] BGA-113 package
Hi All,
We have a rigid flex that has a BGA-113 (microstar BGA) package to be
mounted to it. The routing in this area on the top layer leaves me with
0005 of soldermask clearance from the edge of the BGA pad and .003 distance
from the edge of the soldermask to the nearest track- in other words I have
0035 of clearance from pad edge to next track assuming a perfect etch and
perfect soldermask registration.
Having rooted around Texas Instruments web site I believe that it may be
possible to reflow this BGA without adding solder paste to the pad - just
letting the ball collapse do the attachment. If my scenario is correct I
could open up the soldermask and not have too many concerns about bridging
between the BGA pads and the tracks. Any thoughts or comments would be
appreciated.
Thanks Steve Kelly
Steve Kelly (PLEASE NOTE NEW E-MAIL ADDRESS)
(416) 750-8433 (work)
(416) 750-0016 (fax)
(416) 577-8433 (cell)
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