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May 2009

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Subject:
From:
Karen Tellefsen <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Karen Tellefsen <[log in to unmask]>
Date:
Mon, 11 May 2009 09:33:45 -0400
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At Nepcon west 1999, Al Schneider presented some work  I did on Paralene
and no-clean soldering  materials with disappointing results.  If anyone
wants a copy, email me.

Karen Tellefsen - Electrical Testing
[log in to unmask]
908-791-3069



                                                                           
             Mary Lou Sachenik                                             
             <[log in to unmask]                                             
             OM>                                                        To 
             Sent by: TechNet          [log in to unmask]                     
             <[log in to unmask]>                                          cc 
                                                                           
                                                                   Subject 
             05/09/2009 07:59          [TN] Parylene Adhesion Tape Test    
             AM                                                            
                                                                           
                                                                           
             Please respond to                                             
              TechNet E-Mail                                               
                   Forum                                                   
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             ; Please respond                                              
                    to                                                     
             Mary Lou Sachenik                                             
             <[log in to unmask]                                             
                    OM>                                                    
                                                                           
                                                                           




We recently had some issues with lack of adhesion of Parylene coating

What types of notes are being used on drawings to define parylene
conformal coating adhesion test on pwa's?
Is the ASTM3359-08 (for assessing the adhesion of coating films to
metallic substrates) the best spec to call out for this testing .
I presently don't have pwb coupons to perform destructive cross hatch
test.

What type of tape is being used testing parylene adhesion on the PWA's?
Some specs call out 3M-250 tape, the ASTM D 3359 calls out the Permacel
99.
Actually I prefer the Wescorp 79210 clear Anti-static Tape, does this seem
acceptable?

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