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May 2009

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Subject:
From:
Joyce Koo <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Joyce Koo <[log in to unmask]>
Date:
Fri, 8 May 2009 20:30:16 -0400
Content-Type:
text/plain
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text/plain (135 lines)
Polymeric material pass Tg multiple times.  Aging of adhesives used for die attach.  Molding compound aging due to multiple reflow (pop).  Excessive intermetallic growth at wirebond interface due to multiple reflow.  
--------------------------
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----- Original Message -----
From: TechNet <[log in to unmask]>
To: [log in to unmask] <[log in to unmask]>
Sent: Fri May 08 11:08:09 2009
Subject: Re: [TN] Design considerations for MCM packages

what residual stress?

----- Original Message ----- 
From: "Joyce Koo" <[log in to unmask]>
To: <[log in to unmask]>
Sent: Friday, May 08, 2009 4:22 PM
Subject: Re: [TN] Design considerations for MCM packages


Warpage, residual stress within the package.
--------------------------
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----- Original Message -----
From: TechNet <[log in to unmask]>
To: [log in to unmask] <[log in to unmask]>
Sent: Fri May 08 07:56:04 2009
Subject: [TN] Design considerations for MCM packages


Hi TechNetters and Dewey,

I have to write, rather quickly, kind of design rules or a little handbook. 
I will use own material as well as others.
Question: do you miss something in the below list (borrowed from 
Garrou&Turlic):

7.1  INTRODUCTION
7.2   MECHANICAL DESIGN CONSIDERATIONS  MCM PACKAGES
7.2.1 Package size
7.2.2 Package I/O
7.2.3 Expansion matching
7.2.4 Compliant Leads
7.2.5 Vibration and Shock Considerations
7.3    ELECTRICAL DESIGN CONSIDERATIONS MCM PACKAGES
7.3.1 Package Leads Characteristics
7.3.2 Package Body Electrical Characteristics
7.4   THERMAL DESIGN CONSIDERATIONS MCM PACKAGES
7.4.1 Temperature Extreme Considerations
7.4.2 Temperature Rise Inside MCM Packages
7.5    ENVIRONMENTAL DESIGN CONSIDERATIONS MCM PACKAGES
7.5.1 Thermal  Cycling
7.5.2 Hermeticity Considerations
7.5.3 Pressure Cycling
7.5.4 Hermetic-Equivalent Packaging, Moisture and Corrosion Resistance,
         Reliability without Hermeticity.
7.6    EXAMPLES OF MCM PACKAGE DESIGN APPROACHES
7.6.1 Premolded Plastic MCM Packages
7.6.2 Postmolded Plastic MCM Packages
7.6.3 Encapsulated Chip-on-Board  MCM Packages
7.6.4 Metal Hermetic MCM Packages
7.6.5 Ceramic Hermetic MCM Packages
7.7    Cost Considerations for MCM Packages


If there is something else to add, I would appreciate that very much.

Thanks in advance


Inge

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