The IPC books was a hit, I'm surprised we didn't already have them all. I'll
extract a lot from them, even if they are pretty old. By the way, refreshing
MCM package sources, I found that Schott/USA have extended their program.
Lot's of goodies and good papers, especially their 'MCM handbook' which one
I'll use as reference. To the person who pointed at Schott I say thank you,
sending a sweet red rose and kisses (it was a she). Steven and Richard are
worth a gift too, but a rose might disturbe their manhood. (at least what I
think. People are not always what you think)
Inge
----- Original Message -----
From: "Stadem, Richard D." <[log in to unmask]>
To: <[log in to unmask]>
Sent: Friday, May 08, 2009 2:42 PM
Subject: Re: [TN] Design considerations for MCM packages
Happy Friday, Inge.
If you have access to IPC-2225, IPC-6015, IPC-MC-790, and DD-135 there
is a wealth of information on MCM package design, assembly, and
qualification.
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Hernefjord Ingemar
Sent: Friday, May 08, 2009 6:56 AM
To: [log in to unmask]
Subject: [TN] Design considerations for MCM packages
Hi TechNetters and Dewey,
I have to write, rather quickly, kind of design rules or a little
handbook. I will use own material as well as others.
Question: do you miss something in the below list (borrowed from
Garrou&Turlic):
7.1 INTRODUCTION
7.2 MECHANICAL DESIGN CONSIDERATIONS MCM PACKAGES
7.2.1 Package size
7.2.2 Package I/O
7.2.3 Expansion matching
7.2.4 Compliant Leads
7.2.5 Vibration and Shock Considerations
7.3 ELECTRICAL DESIGN CONSIDERATIONS MCM PACKAGES
7.3.1 Package Leads Characteristics
7.3.2 Package Body Electrical Characteristics
7.4 THERMAL DESIGN CONSIDERATIONS MCM PACKAGES
7.4.1 Temperature Extreme Considerations
7.4.2 Temperature Rise Inside MCM Packages
7.5 ENVIRONMENTAL DESIGN CONSIDERATIONS MCM PACKAGES
7.5.1 Thermal Cycling
7.5.2 Hermeticity Considerations
7.5.3 Pressure Cycling
7.5.4 Hermetic-Equivalent Packaging, Moisture and Corrosion Resistance,
Reliability without Hermeticity.
7.6 EXAMPLES OF MCM PACKAGE DESIGN APPROACHES
7.6.1 Premolded Plastic MCM Packages
7.6.2 Postmolded Plastic MCM Packages
7.6.3 Encapsulated Chip-on-Board MCM Packages
7.6.4 Metal Hermetic MCM Packages
7.6.5 Ceramic Hermetic MCM Packages
7.7 Cost Considerations for MCM Packages
If there is something else to add, I would appreciate that very much.
Thanks in advance
Inge
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