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May 2009

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Subject:
From:
Joyce Koo <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Joyce Koo <[log in to unmask]>
Date:
Fri, 8 May 2009 10:22:28 -0400
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Warpage, residual stress within the package.  
--------------------------
Sent using BlackBerry


----- Original Message -----
From: TechNet <[log in to unmask]>
To: [log in to unmask] <[log in to unmask]>
Sent: Fri May 08 07:56:04 2009
Subject: [TN] Design considerations for MCM packages

 
Hi TechNetters and Dewey,

I have to write, rather quickly, kind of design rules or a little handbook. I will use own material as well as others.
Question: do you miss something in the below list (borrowed from Garrou&Turlic):

7.1  INTRODUCTION
7.2   MECHANICAL DESIGN CONSIDERATIONS  MCM PACKAGES
7.2.1 Package size
7.2.2 Package I/O
7.2.3 Expansion matching
7.2.4 Compliant Leads
7.2.5 Vibration and Shock Considerations
7.3    ELECTRICAL DESIGN CONSIDERATIONS MCM PACKAGES
7.3.1 Package Leads Characteristics
7.3.2 Package Body Electrical Characteristics
7.4   THERMAL DESIGN CONSIDERATIONS MCM PACKAGES
7.4.1 Temperature Extreme Considerations
7.4.2 Temperature Rise Inside MCM Packages
7.5    ENVIRONMENTAL DESIGN CONSIDERATIONS MCM PACKAGES
7.5.1 Thermal  Cycling
7.5.2 Hermeticity Considerations
7.5.3 Pressure Cycling 
7.5.4 Hermetic-Equivalent Packaging, Moisture and Corrosion Resistance,
         Reliability without Hermeticity.
7.6    EXAMPLES OF MCM PACKAGE DESIGN APPROACHES
7.6.1 Premolded Plastic MCM Packages
7.6.2 Postmolded Plastic MCM Packages
7.6.3 Encapsulated Chip-on-Board  MCM Packages
7.6.4 Metal Hermetic MCM Packages
7.6.5 Ceramic Hermetic MCM Packages
7.7    Cost Considerations for MCM Packages


If there is something else to add, I would appreciate that very much.

Thanks in advance


Inge

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