for our own design people
Inge 

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of legg
Sent: fredag 8 maj 2009 14:46
To: [log in to unmask]
Subject: Re: [TN] Design considerations for MCM packages

DFM...

DFT...

Material interaction...

Electromagnetic susceptibility.....

Who is this handbook aimed at?

RL

On Fri, 8 May 2009 13:56:04 +0200, Hernefjord Ingemar <[log in to unmask]> wrote:

> 
>Hi TechNetters and Dewey,
>
>I have to write, rather quickly, kind of design rules or a little handbook.
I will use own material as well as others.
>Question: do you miss something in the below list (borrowed from
Garrou&Turlic):
>
>7.1  INTRODUCTION
>7.2   MECHANICAL DESIGN CONSIDERATIONS  MCM PACKAGES
>7.2.1 Package size
>7.2.2 Package I/O
>7.2.3 Expansion matching
>7.2.4 Compliant Leads
>7.2.5 Vibration and Shock Considerations
>7.3    ELECTRICAL DESIGN CONSIDERATIONS MCM PACKAGES
>7.3.1 Package Leads Characteristics
>7.3.2 Package Body Electrical Characteristics
>7.4   THERMAL DESIGN CONSIDERATIONS MCM PACKAGES
>7.4.1 Temperature Extreme Considerations
>7.4.2 Temperature Rise Inside MCM Packages
>7.5    ENVIRONMENTAL DESIGN CONSIDERATIONS MCM PACKAGES
>7.5.1 Thermal  Cycling
>7.5.2 Hermeticity Considerations
>7.5.3 Pressure Cycling
>7.5.4 Hermetic-Equivalent Packaging, Moisture and Corrosion Resistance,
>         Reliability without Hermeticity.
>7.6    EXAMPLES OF MCM PACKAGE DESIGN APPROACHES
>7.6.1 Premolded Plastic MCM Packages
>7.6.2 Postmolded Plastic MCM Packages
>7.6.3 Encapsulated Chip-on-Board  MCM Packages
>7.6.4 Metal Hermetic MCM Packages
>7.6.5 Ceramic Hermetic MCM Packages
>7.7    Cost Considerations for MCM Packages
>
>
>If there is something else to add, I would appreciate that very much.
>
>Thanks in advance
>
>
>Inge
>
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