Thanks, Trikeman,
your adds are much valued.
/Inge 

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Steven Creswick
Sent: fredag 8 maj 2009 14:37
To: [log in to unmask]
Subject: Re: [TN] Design considerations for MCM packages

Inge,

Here are a few ideas.  I tucked them into your listing [without paragraph numbers]

Steve

7.1  INTRODUCTION
7.2   MECHANICAL DESIGN CONSIDERATIONS  MCM PACKAGES
7.2.1 Package size
      Package mass
7.2.2 Package I/O
      Package seal approach? - hermetic/non-hermetic, etc.
      Plating requirements?
      Marking requirements?
7.2.3 Expansion matching
7.2.4 Compliant Leads
7.2.5 Vibration and Shock Considerations

7.3    ELECTRICAL DESIGN CONSIDERATIONS MCM PACKAGES
7.3.1 Package Leads Characteristics
      Alloy?
      Wire bondability?
      Solderability?
7.3.2 Package Body Electrical Characteristics

7.4   THERMAL DESIGN CONSIDERATIONS MCM PACKAGES
7.4.1 Temperature Extreme Considerations
7.4.2 Temperature Rise Inside MCM Packages

7.5    ENVIRONMENTAL DESIGN CONSIDERATIONS MCM PACKAGES 
      Reference Mil-Std screening requirements?
7.5.1 Thermal Cycling
      Thermal shock?
      Salt spray/corrosion resistance?
      Constant acceleration?
      PIND?
7.5.2 Hermeticity Considerations - fine leak vs permeation rates? 
7.5.3 Pressure Cycling - limits, cycle and dwell times ?
7.5.4 Hermetic-Equivalent Packaging, Moisture and Corrosion Resistance,
         Reliability without Hermeticity.
      Marking permanency?

7.6    EXAMPLES OF MCM PACKAGE DESIGN APPROACHES
7.6.1 Premolded Plastic MCM Packages
7.6.2 Postmolded Plastic MCM Packages
7.6.3 Encapsulated Chip-on-Board  MCM Packages
7.6.4 Metal Hermetic MCM Packages
7.6.5 Ceramic Hermetic MCM Packages
      HTCC?
      LTCC?

7.7    Cost Considerations for MCM Packages

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Technet Mail List provided as a service by IPC using LISTSERV 15.0
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
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Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815
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