DFM...

DFT...

Material interaction...

Electromagnetic susceptibility.....

Who is this handbook aimed at?

RL

On Fri, 8 May 2009 13:56:04 +0200, Hernefjord Ingemar
<[log in to unmask]> wrote:

> 
>Hi TechNetters and Dewey,
>
>I have to write, rather quickly, kind of design rules or a little handbook.
I will use own material as well as others.
>Question: do you miss something in the below list (borrowed from
Garrou&Turlic):
>
>7.1  INTRODUCTION
>7.2   MECHANICAL DESIGN CONSIDERATIONS  MCM PACKAGES
>7.2.1 Package size
>7.2.2 Package I/O
>7.2.3 Expansion matching
>7.2.4 Compliant Leads
>7.2.5 Vibration and Shock Considerations
>7.3    ELECTRICAL DESIGN CONSIDERATIONS MCM PACKAGES
>7.3.1 Package Leads Characteristics
>7.3.2 Package Body Electrical Characteristics
>7.4   THERMAL DESIGN CONSIDERATIONS MCM PACKAGES
>7.4.1 Temperature Extreme Considerations
>7.4.2 Temperature Rise Inside MCM Packages
>7.5    ENVIRONMENTAL DESIGN CONSIDERATIONS MCM PACKAGES
>7.5.1 Thermal  Cycling
>7.5.2 Hermeticity Considerations
>7.5.3 Pressure Cycling 
>7.5.4 Hermetic-Equivalent Packaging, Moisture and Corrosion Resistance,
>         Reliability without Hermeticity.
>7.6    EXAMPLES OF MCM PACKAGE DESIGN APPROACHES
>7.6.1 Premolded Plastic MCM Packages
>7.6.2 Postmolded Plastic MCM Packages
>7.6.3 Encapsulated Chip-on-Board  MCM Packages
>7.6.4 Metal Hermetic MCM Packages
>7.6.5 Ceramic Hermetic MCM Packages
>7.7    Cost Considerations for MCM Packages
>
>
>If there is something else to add, I would appreciate that very much.
>
>Thanks in advance
>
>
>Inge
>
>---------------------------------------------------
>Technet Mail List provided as a service by IPC using LISTSERV 15.0
>To unsubscribe, send a message to [log in to unmask] with following text in
>the BODY (NOT the subject field): SIGNOFF Technet
>To temporarily halt or (re-start) delivery of Technet send e-mail to
[log in to unmask]: SET Technet NOMAIL or (MAIL)
>To receive ONE mailing per day of all the posts: send e-mail to
[log in to unmask]: SET Technet Digest
>Search the archives of previous posts at: http://listserv.ipc.org/archives
>Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16
for additional information, or contact Keach Sasamori at [log in to unmask] or
847-615-7100 ext.2815
>-----------------------------------------------------

---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 15.0
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815
-----------------------------------------------------