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May 2009

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Subject:
From:
"Stadem, Richard D." <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Stadem, Richard D.
Date:
Fri, 8 May 2009 07:42:51 -0500
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Happy Friday, Inge.
If you have access to IPC-2225, IPC-6015, IPC-MC-790, and DD-135 there
is a wealth of information on MCM package design, assembly, and
qualification.

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Hernefjord Ingemar
Sent: Friday, May 08, 2009 6:56 AM
To: [log in to unmask]
Subject: [TN] Design considerations for MCM packages

 
Hi TechNetters and Dewey,

I have to write, rather quickly, kind of design rules or a little
handbook. I will use own material as well as others.
Question: do you miss something in the below list (borrowed from
Garrou&Turlic):

7.1  INTRODUCTION
7.2   MECHANICAL DESIGN CONSIDERATIONS  MCM PACKAGES
7.2.1 Package size
7.2.2 Package I/O
7.2.3 Expansion matching
7.2.4 Compliant Leads
7.2.5 Vibration and Shock Considerations
7.3    ELECTRICAL DESIGN CONSIDERATIONS MCM PACKAGES
7.3.1 Package Leads Characteristics
7.3.2 Package Body Electrical Characteristics
7.4   THERMAL DESIGN CONSIDERATIONS MCM PACKAGES
7.4.1 Temperature Extreme Considerations
7.4.2 Temperature Rise Inside MCM Packages
7.5    ENVIRONMENTAL DESIGN CONSIDERATIONS MCM PACKAGES
7.5.1 Thermal  Cycling
7.5.2 Hermeticity Considerations
7.5.3 Pressure Cycling 
7.5.4 Hermetic-Equivalent Packaging, Moisture and Corrosion Resistance,
         Reliability without Hermeticity.
7.6    EXAMPLES OF MCM PACKAGE DESIGN APPROACHES
7.6.1 Premolded Plastic MCM Packages
7.6.2 Postmolded Plastic MCM Packages
7.6.3 Encapsulated Chip-on-Board  MCM Packages
7.6.4 Metal Hermetic MCM Packages
7.6.5 Ceramic Hermetic MCM Packages
7.7    Cost Considerations for MCM Packages


If there is something else to add, I would appreciate that very much.

Thanks in advance


Inge

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