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May 2009

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Subject:
Re: Design considerations for MCM packages
From:
Steven Creswick <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Steven Creswick <[log in to unmask]>
Date:
Fri, 8 May 2009 08:42:02 -0400
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Inge,

I should have added these

Steve

Screening tests - Autoclave for non-hermetic packages!


7.6    EXAMPLES OF MCM PACKAGE DESIGN APPROACHES
7.6.1 Premolded Plastic MCM Packages
7.6.2 Postmolded Plastic MCM Packages
7.6.3 Encapsulated Chip-on-Board  MCM Packages
      Chip on flex?
      Chip on glass?
7.6.4 Metal Hermetic MCM Packages
      Compression seal?
      Matched seal?
7.6.5 Ceramic Hermetic MCM Packages
      HTCC?
      LTCC?

7.7    Cost Considerations for MCM Packages

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