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May 2009

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Subject:
From:
"Wenger, George M." <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Wenger, George M.
Date:
Thu, 7 May 2009 09:34:14 -0400
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What is the surface finish on the PCB?  If it is HA


Joe,



What is the surface finish on the PCB?  If it is HASL there is a reason

for the  contamination.



Regards,

George

George M. Wenger

Andrew Wireless Solutions

Senior Principal FMA/Reliability Engineer

40 Technology Drive, Warren, NJ 07059

(908) 546-4531 (Office) (732) 309-8964 (cell)

[log in to unmask]

-----Original Message-----

From: TechNet [mailto:[log in to unmask]] On Behalf Of Kane, Joseph E (US

SSA)

Sent: Thursday, May 07, 2009 9:13 AM

To: [log in to unmask]

Subject: [TN] PB Surface Contamination



A cleaned bare PB is exposed to bake or reflow, and comes out with

measurable ionic contamination.  The board is dirtier at the surface

after 

a heat excursion.



The contamination isn't coming from the oven, handling, or anything

external.

Heat causes something to move from the inside of the board to the

outside.



We haven't done any ion chromatography or other testing yet to

run this down, but has anyone heard of or experienced anything similar?



In our normal process, we clean everything multiple times, but if the 

contaminant builds up under solder mask, or in other areas that are 

difficult to clean, we could have SIR or corrosion problems around fine 

surface features or in high voltage areas.



And if this ionic contamination doesn't just move up to the surface,

but is somehow moving around inside the board, could it collect in 

some places and lead to CAF or other problems?



Joe Kane

BAE Systems

Johnson City, NY 





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