Lenny 
I would suggest a different non-chemical approach by freezing the ballast  
and then chipping or cutting the frozen pitch material to get to the surface 
for  Failure Analysis.  We have found that pitch can be contaminated and 
cause  leakage and corrosion problems. We have also found that capacitors can 
leak and  the electrolyte will dissolve the material and cause leakage and 
corrosion  problems.  If you have solder joint problems then this approach 
works well  to investigate the joint quality as well.  If you have an question 
please  call.  
Terry Munson
765-457-8095
 
 
In a message dated 5/29/2009 2:01:42 P.M. Eastern Daylight Time,  
[log in to unmask] writes:

We have  a lighting ballast in for failure analysis and arent sure how to 
get the  encapsulant "tar" from it?
This is a lighting ballast and we have the metal  covers removed and are 
left with a ballast assy built on a pcb, and covered in  a thick,  black,  
semi-pliable, tar-like encapsulant. 
The  tar-like encapsualant smells just like roofing tar.  If you lay it on 
a  piece of notepaper it stains it just like roofing tar.  It can be peeled  
away just like a roofing tar.  We are afraid of poking too much and  
damaging components or circuits.  Anybody have experience with it? - and  know 
what it is?  and how to let it soak in a pan of something and rinse  this stuff 
of instead?  Better ideas?
Thanks in advance,
Lenny  Carter
Design Engineer
ERG, Inc.
ph (607) 754-9187  x3063
www.ergpower.com

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