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May 2009

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Subject:
From:
"David D. Hillman" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, [log in to unmask]
Date:
Fri, 29 May 2009 11:38:00 -0500
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Hi Inge - a polish material does not necessarily leave a film behind on 
the polished surface - most metallographic cross-sectional processes are 
designed to NOT leave any film on the prepared surface. Auger analysis is 
typically used for surface film investigation as it can see films in the 
20-200 angstrom range.

Dave Hillman
Rockwell Collins
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Inge <[log in to unmask]> 
Sent by: TechNet <[log in to unmask]>
05/29/2009 09:33 AM
Please respond to
TechNet E-Mail Forum <[log in to unmask]>; Please respond to
Inge <[log in to unmask]>


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Subject
[TN] WAX






Hi all and even Bev,

Assume that you polish a metal, in my case five 9s Ag. Polishes have at 
least two purposes. Grind the metal to get a certain level of brightness 
(we 
polish to Ra 30 nanometers). And leave a thin coating that protects the 
metal. Now, in our case, what is left is so thin, that you can't observe 
the 
'coating'.  Presumably because it's an organic compound of some sort, and 
also because it's transparent for our eye's wavelength. Now comes the 
question:  has anyone out there ever investigated such a 'wax' and 
determined the thickness, and if so, what kind of equipment was used? 
That's why I more or less directed the q to Bev...

Inge 

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