Does the solder fillet exhibit a blue tinge and grainy appearance?
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Hernefjord Ingemar
Sent: Wednesday, May 27, 2009 8:46 AM
To: [log in to unmask]
Subject: Re: [TN] humidity test failure
Richard,
(A) Wenger is effective and very sharp. I both know and have one.
Inge
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Stadem, Richard D.
Sent: onsdag 27 maj 2009 15:07
To: [log in to unmask]
Subject: Re: [TN] humidity test failure
Also, what is the voltage that was applied across the cap during the
testing? What is the value of the cap and what is its voltage rating?
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Wenger, George M.
Sent: Wednesday, May 27, 2009 7:31 AM
To: [log in to unmask]
Subject: Re: [TN] humidity test failure
In order to give you an meaningful answer I think we need Wayne,
In order to give you an meaningful answer I think we need more
information from your side.
1. Where the capacitors wave soldered or reflow soldered?
2. What type of flux was used?
3. What solvent was used?
4. What type of cleaning process was used?
Regards,
George
George M. Wenger
Andrew Solutions
Senior Principal FMA/Reliability Engineer 40 Technology Drive, Warren,
NJ 07059
(908) 546-4531 (Office) (732) 309-8964 (cell) [log in to unmask]
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Kevin Glidden
Sent: Wednesday, May 27, 2009 8:24 AM
To: [log in to unmask]
Subject: Re: [TN] humidity test failure
Looks like whatever it is it may have started from residues leaching
from UNDER the component. The voltage bias and environment would have
only
accelerated this. The solder joints exposed to the cleaning process
look
fine. You should review your cleaning procedures and perform testing
(IC/SIR) to determine if you are adequately cleaning, rinsing, and
drying to remove contaminants from under low-standoff components. My
suspicion is that if that is in fact the case, and you decided to try to
conformal coat, the problem would have only manifested itself sooner
with conformal coat adhesion problems.
-----Original Message-----
From: Steve Gregory [mailto:[log in to unmask]]
Sent: Wednesday, May 27, 2009 8:00 AM
To: [log in to unmask]
Subject: Re: [TN] humidity test failure
Good Morning!
Half the week down already. That's another nice thing about 3-day
weekends; you also get a 4-day work week either prior to, or after the
weekend.
I have Wayne's picture posted now. It's at:
http://stevezeva.homestead.com/files/C23_Humidity_failure.JPG
Definitely some kinda' junk there!
Steve
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Thayer, Wayne
Sent: Tuesday, May 26, 2009 9:01 PM
To: [log in to unmask]
Subject: [TN] humidity test failure
Hi Technet Gurus!
I have attached a picture of a part responsible for excess current draw
during an extended humidity/temperature cycling test. (I copied Steve so
he can hopefully post!)
The board was carefully solvent cleaned, but no SIR test validating the
process strips all ionic contamination. The board is in an enclosure
where plenty of ionic contaminants are available.
Humidity was supposed to not exceed 90% and was to be non-condensing
during cycling. There were a handful of components which displayed
similar deposits on the same circuit board. These were the only parts
biased during the humidity test. I believe the evidence suggests at
least some condensation occurred. To me the deposits look like salts.
But what do "the experts" think?
Is there any rule of thumb as to humidity levels where we are nuts to
try to survive without conformal coating? Part of the adjacent
circuitry contains RF devices and those guys get panic-stricken when
told we probably need to conformal coat!
Wayne Thayer
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