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May 2009

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Subject:
From:
John Burke <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, John Burke <[log in to unmask]>
Date:
Mon, 25 May 2009 18:43:42 -0700
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Interesting - anyone know the patent number for that? I remember Rolf
Strauss the inventor of wave soldering describing such a process to me 20
years ago while we were having lunch in London. I believe he actually did
take out a position but in true style over lunch did indeed sketch it out
for me on the back of a napkin...........

John Burke
(408) 515 4992

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Thayer, Wayne
Sent: Sunday, May 24, 2009 6:16 AM
To: [log in to unmask]
Subject: [TN] Solder Jetting

This technology was first publicized around 5 years ago.  It uses a droplet
dispenser head to "spit" molten solder at the circuit.  I think it didn't
take off because better technologies for wafer bumping were developed.

Has anyone in TechNet tried to use this technology?  It was put on a Mydata
about 4 years ago.  Seems like it might be good for prototyping--deposit
solder and then use a spray flux.  Patterns could be set up which assisted
with "nesting" BGAs.

Wayne Thayer



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