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May 2009

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Subject:
From:
Bev Christian <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Bev Christian <[log in to unmask]>
Date:
Sun, 24 May 2009 10:15:03 -0400
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text/plain
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TechNetters,
I'm looking for a one panel cartoon published 2001 or earlier where there are two men and one is pushing the face of the other into a circuit pack and is exclaiming, "Bad designer! Bad designer!". Can anyone tell me where I can find this cartoon?
Bev
RIM

----- Original Message -----
From: TechNet <[log in to unmask]>
To: [log in to unmask] <[log in to unmask]>
Sent: Sun May 24 09:15:36 2009
Subject: [TN] Solder Jetting

This technology was first publicized around 5 years ago.  It uses a droplet dispenser head to "spit" molten solder at the circuit.  I think it didn't take off because better technologies for wafer bumping were developed.

Has anyone in TechNet tried to use this technology?  It was put on a Mydata about 4 years ago.  Seems like it might be good for prototyping--deposit solder and then use a spray flux.  Patterns could be set up which assisted with "nesting" BGAs.

Wayne Thayer



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