The test methods are described in ASTM-F-22.

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Victor Hernandez
Sent: Friday, May 22, 2009 8:18 AM
To: [log in to unmask]
Subject: Re: [TN] Golden finger (Golden Pad) clear and protect method

Is the water break tape test conducted on sample surface prior to Ni/Au
plating or afterward.   Can someone share a copy of the standard?

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Bob Willis
Sent: Friday, May 22, 2009 3:15 AM
To: [log in to unmask]
Subject: Re: [TN] Golden finger (Golden Pad) clear and protect method

If you are using Kapton tape you are doing what the industry does but
its
always worth testing the tape you get from different supplier with a
water
break test. This is old school engineering but still works fine for
material
supplier comparisons

Many thanks

Bob Willis
2 Fourth Ave, Chelmsford, Essex, CM1 4HA England
Tel: (44) 1245 351502
Fax: (44) 1245 496123
Mobile: 07860 775858
www.ASKbobwillis.com
PCB Design for Manufacture & Assembly Workshop 15th October
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-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Wang, Rocky
Sent: 22 May 2009 04:41
To: [log in to unmask]
Subject: [TN] Golden finger (Golden Pad) clear and protect method

Dear all:
         Anybody know that if there has special method to clean the
golden finger's foreign matter or not. And if there have some industry
standard indicate how to handle it?If can use the IPA to clean the
golden finger or not? 
        For the protect method, we apply the Kapton tape cover the
golden finger before build.

Best  Regards
 
Wang Rong

"This email is confidential. Any unauthorized use or disclosure is 
strictly prohibited."

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