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May 2009

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Subject:
From:
Bob Willis <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Bob Willis <[log in to unmask]>
Date:
Wed, 20 May 2009 11:44:11 +0100
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Working in South Africa at the moment but I did produce a standard or some
guidelines some years back for Speedline Workshop. I will circulate a link
when I get back to my office providing I can still find it.

I always wanted to do this and produce a set of images to go with my
underfill workshop.

Send the link to all when I get away from the sharks!!

Bob Willis
2 Fourth Ave, Chelmsford, Essex, CM1 4HA England
Tel: (44) 1245 351502
Fax: (44) 1245 496123
Mobile: 07860 775858
www.ASKbobwillis.com
PCB Design for Manufacture & Assembly Workshop 15th October
www.ASKbobwillis.com 
PCB Inspection & Quality Control Workshop 3rd November
www.ASKbobwillis.com/faworkshops.pdf
Book Bob's "Step by Step Failure Analysis Workshop" 4th November
www.ASKbobwillis.com/faworkshops.pdf
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Bev Christian
Sent: 19 May 2009 18:52
To: [log in to unmask]
Subject: [TN] Underfill Pass/fail criteria

TechNetters,
I am aware of J-STd-030 "Guideline for Selection & Application of
Underfill" and the existence of IPC standards committee 5-24F "Underfill
Adhesives for Flip Chip Applications".  There is nothing in IPC-A-610D
about underfills.  I have taken Brian Toleno's very good course on
underfills, but on going back and looking at the CD, I don't see
anything on pass/fail criteria.  Do any of you know of an international
standard (American, IEC, Japanese) with pass/fail criteria for cured
underfills?

I am particularly interested in what said standard (or anything you want
to tell me) says about coverage and voiding.

Bev
RIM

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