Hi Bev - I don't know of any industry requirements but I do have an 
internal standard developed based on discussions with Brian T, other 
industry material suppliers and test data. We can discuss when I see ya at 
the SMTA Toronto conference this week if you want. None of the 
"requirements" are rocket science and some of it is based on 
qualified/demonstrated process control.

Dave Hillman
Rockwell Collins
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Bev Christian <[log in to unmask]> 
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05/19/2009 12:51 PM
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Subject
[TN] Underfill Pass/fail criteria






TechNetters,
I am aware of J-STd-030 "Guideline for Selection & Application of
Underfill" and the existence of IPC standards committee 5-24F "Underfill
Adhesives for Flip Chip Applications".  There is nothing in IPC-A-610D
about underfills.  I have taken Brian Toleno's very good course on
underfills, but on going back and looking at the CD, I don't see
anything on pass/fail criteria.  Do any of you know of an international
standard (American, IEC, Japanese) with pass/fail criteria for cured
underfills?

I am particularly interested in what said standard (or anything you want
to tell me) says about coverage and voiding.

Bev
RIM

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