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May 2009

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Subject:
From:
"Stadem, Richard D." <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Stadem, Richard D.
Date:
Tue, 19 May 2009 15:00:37 -0500
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Ok, Bev. Here goes.
IPC-7095 has very good examples of acceptable underfill for BGAs,
including good, bad, and ugly pictures of insufficient, excess, voided,
etc., underfill. It is all listed in Section 7.2.2. Also included is
very good instructions on interpretation of Scanning Acoustic Imaging
examples, and the use of C-SAM thereof.
IPC-7094 has ditto for Flipchips and CSPs.
Either of these fine documents are available for sale from your nearest
IPC supermarket.

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Bev Christian
Sent: Tuesday, May 19, 2009 12:52 PM
To: [log in to unmask]
Subject: [TN] Underfill Pass/fail criteria

TechNetters,
I am aware of J-STd-030 "Guideline for Selection & Application of
Underfill" and the existence of IPC standards committee 5-24F "Underfill
Adhesives for Flip Chip Applications".  There is nothing in IPC-A-610D
about underfills.  I have taken Brian Toleno's very good course on
underfills, but on going back and looking at the CD, I don't see
anything on pass/fail criteria.  Do any of you know of an international
standard (American, IEC, Japanese) with pass/fail criteria for cured
underfills?

I am particularly interested in what said standard (or anything you want
to tell me) says about coverage and voiding.

Bev
RIM

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