You rang?
Dewey
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Werner Engelmaier /*
Sent: Tuesday, May 19, 2009 12:01 PM
To: [log in to unmask]
Subject: Re: [TN] Underfill Pass/fail criteria
Hi Graham,
The English language is wonderfully adapt to explain things-that is why
it has displaced French as the language of diplomacy and German as the
language of technology-it is now a great lingua franca.
I try [nobody is perfect, as my wife reminds me all the time], but
sometimes I do not succeed in conveying the meaning properly.
What do I need to clarify, if not to say dumb down?
Werner
-----Original Message-----
From: Graham Collins <[log in to unmask]>
To: [log in to unmask]
Sent: Tue, 19 May 2009 2:31 pm
Subject: Re: [TN] Underfill Pass/fail criteria
For the rest of us, it's possible to get a copy of Werner's article at:
http://www.globalsmt.net/index.php?option=com_content&task=view&id=33&It
emid=65
Now if only I could get him to explain it to me in small words... :-)
regards,
- Graham Collins
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Werner Engelmaier /*
Sent: Tuesday, May 19, 2009 3:18 PM
To: [log in to unmask]
Subject: Re: [TN] Underfill Pass/fail criteria
Hi Bev,
Clearly, the most important SJs that need to be covered are the
outermost rows
and the rows directly underneath the die outline-this later is most
important
for face-up BGAs and CSPs.
I do not know if one can write generally applicable pass/fail criteria
[because,
what else, 'It depends'].
I ave attached a column of mine on underfills [sorry for the rest of you
for
whom IPC strips the attachment], Engelmaier, W., "Rel
iability Improvement with
Underfill," Global SMT & Packaging, Vol. 6, No. 3, March 2006, pp.
66-67.
Werner
-----Original Message-----
From: Bev Christian <[log in to unmask]>
To: [log in to unmask]
Sent: Tue, 19 May 2009 1:51 pm
Subject: [TN] Underfill Pass/fail criteria
TechNetters,
I am aware of J-STd-030 "Guideline for Selection & Application of
Underfill" and the existence of IPC standards committee 5-24F "Underfill
Adhesives for Flip Chip Applications". There is nothing in IPC-A-610D
about underfills. I have taken Brian Toleno's very good course on
underfills, but on going back and looking at the CD, I don't see
anything on pass/fail criteria. Do any of you know of an international
standard (American, IEC, Japanese) with pass/fail criteria for cured
underfills?
I am particularly interested in what said standard (or anything you want
to tell me) says about coverage and voiding.
Bev
RIM
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