Bev,
You missed the biggest disadvantage—it is destructive.
I would think the completeness of underfill coverage depends at least to some degree on the degree of the quality of the flux removal process underneath the component. Thus, I would think you will find something different with each component.
Having a destructive method may give you 100% scrap, 8-(
Werner
-----Original Message-----
From: Bev Christian <[log in to unmask]>
To: [log in to unmask]
Sent: Tue, 19 May 2009 2:54 pm
Subject: Re: [TN] Underfill Pass/fail criteria
Ioan,
Well if you don't have any expletive deleted RF cans in the way, you can use
acoustic microscopy. Otherwise your choices are:
1) Prying
2) Vertical cross-sectioning
3) Horizontal cross-sectioning
Here blow are my perceived advantages and disadvantages of each. I pasted the
table in as HTML. Hope this shows up in TechNet!
Method
Advantages
Disadvantages
Prying
Fast, easy, can be done by anyone, checks whole area under component at once
Misses embedded voids that don't reach the underfill/component interface
Vertical Cross-sectioning
Finds buried voids
Requires lab staff, only finds voids in the particular plane sectioned, unless
grind further (very time consuming)
Horizontal cross-sectioning
Finds buried voids, checks whole area under component
Requires lab staff, very time consuming
Bev
RIM
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Ioan Tempea
Sent: Tuesday,20May 19, 2009 2:40 PM
To: [log in to unmask]
Subject: Re: [TN] Underfill Pass/fail criteria
Bev,
No answer here, but one question: how can one visualize and measure voiding in
underfills?
Thanks,
Ioan Tempea, ing.
t : 450-967-7100 ext : 244
[log in to unmask]
www.digico.cc
P N'imprimer que si nécessaire - Print only if you must
-----Message d'origine-----
De : Bev Christian [mailto:[log in to unmask]]
Envoyé : 19 mai 2009 13:52
À : [log in to unmask]
Objet : [TN] Underfill Pass/fail criteria
TechNetters,
I am aware of J-STd-030 "Guideline for Selection & Application of
Underfill" and the existence of IPC standards committee 5-24F "Underfill
Adhesives for Flip Chip Applications". There is nothing in IPC-A-610D
about underfills. I have taken Brian Toleno's very good course on
underfills, but on going back and looking at the CD, I don't see
anything on pass/fail criteria. Do any of you know of an international
standard (American, IEC, Japanese) with pass/fail criteria for cured
underfills?
I am particularly interested in what said standard (or anything you want
to tell me) says about coverage and voiding.
Bev
RIM
---------------------------------------------------------------------
This transmission (including any attachments) may contain confidential
information, privileged material (including material protected by the
solicitor-client or other applicable privileges), or constitute non-public
information. Any use of this informa
tion by anyone other than the intended
recipient is prohibited. If you have received this transmission in error, please
immediately reply to the sender and delete this information from your system.
Use, dissemination, distribution, or reproduction of this transmission by
unintended recipients is not authorized and may be unlawful.
---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 15.0
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to
[log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to
[log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for
additional information, or contact Keach Sasamori at [log in to unmask] or
847-615-7100 ext.2815
-----------------------------------------------------
---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 15.0
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to
[log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to
[log in to unmask]: SET T
echnet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for
additional information, or contact Keach Sasamori at [log in to unmask] or
847-615-7100 ext.2815
-----------------------------------------------------
---------------------------------------------------------------------
This transmission (including any attachments) may contain confidential
information, privileged material (including material protected by the
solicitor-client or other applicable privileges), or constitute non-public
information. Any use of this information by anyone other than the intended
recipient is prohibited. If you have received this transmission in error, please
immediately reply to the sender and delete this information from your system.
Use, dissemination, distribution, or reproduction of this transmission by
unintended recipients is not authorized and may be unlawful.
---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 15.0
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to
[log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to
[log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for
additional information,=2
0or contact Keach Sasamori at [log in to unmask] or
847-615-7100 ext.2815
-----------------------------------------------------
---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 15.0
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815
-----------------------------------------------------
|
