Since Ken and Doug have attempted to handle the humor, I guess I'll have to fill in the technical details. A list of requirements is as follows:

 

*         The laminate shall have maximum moisture absorption of 0.5% (The actual fabricated bare PB shall have 0.2 % prior to processing).

*         The laminates and bonding materials shall have a flammability rating of V-0 minimum.

*         The laminate shall have a glass transition temperature of 170°C minimum.

*         The laminate shall have a decomposition temperature of 340°C minimum.

*         The allowable point to point variation of the laminate Z-Axis CTE shall be no greater than 3.5% (ideally 3.0% or less) when tested between 50 to 260°C.

*         The laminate shall demonstrate meeting the requirements for thermal resistance to T288 testing for a minimum of 5 minutes.

*         There shall be objective evidence that the laminate material is resistant to conductive anodic filament (CAF) growth.

 

There are other things to consider such as phenolic cure systems and plating adhesion, but this is a start. IPC-4101/126 and /129 are good examples of high performance FR4s.

Dewey 

 

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Harris Dy
Sent: Tuesday, May 05, 2009 10:23 AM
To: [log in to unmask]
Subject: [TN] What does HIGH GRADE FR-4 mean?

 

Hi All,

 

Can anyone define High Grade FR-4? 

 

I think it's a vague requirement that I see on customer drawing. Is this something that should be obsolete now because today customer should really provide the properties of the laminate that they want to use... eg Tg, Td, Dk.

 

Can anyone shed some light?

 

Thanks,

Harris

 

 

 

 

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