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May 2009

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Subject:
From:
Werner Engelmaier /* <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, [log in to unmask]
Date:
Tue, 19 May 2009 15:02:10 -0400
Content-Type:
text/plain
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text/plain (409 lines)
 Bev,
I am afraid you may not get anything better than what I said already.
Werner


 


 

-----Original Message-----
From: Bev Christian <[log in to unmask]>
To: [log in to unmask]; [log in to unmask]
Sent: Tue, 19 May 2009 2:38 pm
Subject: RE: [TN] Underfill Pass/fail criteria

























Werner,



Yes, this is a very nice article. I remember
reading it now.  This gives some guidelines for characteristics of the material. 
However, what I am looking for are visual/instrumental measurement parameters
for saying whether the cured underfill under a CSP or BGA is good or not.



Bev



RIM
















From:
[log in to unmask] [mailto:[log in to unmask]] 

Sent: Tuesday, May 19, 2009 2:18
PM

To: [log in to unmask]; Bev Christian

Subject: Re: [TN] Underfill
Pass/fail criteria






 






Hi Bev,

Clearly, the most important SJs that need to be covered are the outermost rows
and the rows directly underneath the die outline—this later is most important
for face-up BGAs and CSPs.

I do not know if one can write generally applicable pass/fail criteria
[because, what else, 'It depends'].

I ave attached a column of mine on underfills [sorry for the rest of you for
whom IPC strips the attachment], Engelmaier, W., “Reliability Improvement with
Underfill,” Global SMT & Packaging, Vol. 6, No. 3, March 2006, pp. 66-67. 

Werner









 









 






----
-Original
Message-----

From: Bev Christian <[log in to unmask]>

To: [log in to unmask]

Sent: Tue, 19 May 2009 1:51 pm

Subject: [TN] Underfill Pass/fail criteria




TechNetters,





I am aware of J-STd-030 "Guideline for Selection & Application of





Underfill" and the existence of IPC standards committee 5-24F "Underfill





Adhesives for Flip Chip Applications".  There is nothing in IPC-A-610D





about underfills.  I have taken Brian Toleno's very good course on





underfills, but on going back and looking at the CD, I don't see





anything on pass/fail criteria.  Do any of you know of an international





standard (American, IEC, Japanese) with pass/fail criteria for cured





underfills?











I am particularly interested in what said standard (or anything you want





to tell me) says about coverage and voiding.











Bev





RIM











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