Ioan,
Well if you don't have any expletive deleted RF cans in the way, you can use acoustic microscopy. Otherwise your choices are:
1) Prying
2) Vertical cross-sectioning
3) Horizontal cross-sectioning
Here blow are my perceived advantages and disadvantages of each. I pasted the table in as HTML. Hope this shows up in TechNet!
Method
Advantages
Disadvantages
Prying
Fast, easy, can be done by anyone, checks whole area under component at once
Misses embedded voids that don't reach the underfill/component interface
Vertical Cross-sectioning
Finds buried voids
Requires lab staff, only finds voids in the particular plane sectioned, unless grind further (very time consuming)
Horizontal cross-sectioning
Finds buried voids, checks whole area under component
Requires lab staff, very time consuming
Bev
RIM
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Ioan Tempea
Sent: Tuesday, May 19, 2009 2:40 PM
To: [log in to unmask]
Subject: Re: [TN] Underfill Pass/fail criteria
Bev,
No answer here, but one question: how can one visualize and measure voiding in underfills?
Thanks,
Ioan Tempea, ing.
t : 450-967-7100 ext : 244
[log in to unmask]
www.digico.cc
P N'imprimer que si nécessaire - Print only if you must
-----Message d'origine-----
De : Bev Christian [mailto:[log in to unmask]]
Envoyé : 19 mai 2009 13:52
À : [log in to unmask]
Objet : [TN] Underfill Pass/fail criteria
TechNetters,
I am aware of J-STd-030 "Guideline for Selection & Application of
Underfill" and the existence of IPC standards committee 5-24F "Underfill
Adhesives for Flip Chip Applications". There is nothing in IPC-A-610D
about underfills. I have taken Brian Toleno's very good course on
underfills, but on going back and looking at the CD, I don't see
anything on pass/fail criteria. Do any of you know of an international
standard (American, IEC, Japanese) with pass/fail criteria for cured
underfills?
I am particularly interested in what said standard (or anything you want
to tell me) says about coverage and voiding.
Bev
RIM
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