Werner,
Yes, this is a very nice article. I remember reading it now. This gives
some guidelines for characteristics of the material. However, what I am
looking for are visual/instrumental measurement parameters for saying
whether the cured underfill under a CSP or BGA is good or not.
Bev
RIM
________________________________
From: [log in to unmask] [mailto:[log in to unmask]]
Sent: Tuesday, May 19, 2009 2:18 PM
To: [log in to unmask]; Bev Christian
Subject: Re: [TN] Underfill Pass/fail criteria
Hi Bev,
Clearly, the most important SJs that need to be covered are the
outermost rows and the rows directly underneath the die outline-this
later is most important for face-up BGAs and CSPs.
I do not know if one can write generally applicable pass/fail criteria
[because, what else, 'It depends'].
I ave attached a column of mine on underfills [sorry for the rest of you
for whom IPC strips the attachment], Engelmaier, W., "Reliability
Improvement with Underfill," Global SMT & Packaging, Vol. 6, No. 3,
March 2006, pp. 66-67.
Werner
-----Original Message-----
From: Bev Christian <[log in to unmask]>
To: [log in to unmask]
Sent: Tue, 19 May 2009 1:51 pm
Subject: [TN] Underfill Pass/fail criteria
TechNetters,
I am aware of J-STd-030 "Guideline for Selection & Application of
Underfill" and the existence of IPC standards committee 5-24F "Underfill
Adhesives for Flip Chip Applications". There is nothing in IPC-A-610D
about underfills. I have taken Brian Toleno's very good course on
underfills, but on going back and looking at the CD, I don't see
anything on pass/fail criteria. Do any of you know of an international
standard (American, IEC, Japanese) with pass/fail criteria for cured
underfills?
I am particularly interested in what said standard (or anything you want
to tell me) says about coverage and voiding.
Bev
RIM
---------------------------------------------------------------------
This transmission (including any attachments) may contain confidential
information, privileged material (including material protected by the
solicitor-client or other applicable privileges), or constitute
non-public
information. Any use of this information by anyone other than the
intended
recipient is prohibited. If you have received this transmission in
error, please
immediately reply to the sender and delete this information from your
system.
Use, dissemination, distribution, or reproduction of this transmission
by
unintended recipients is not authorized and may be unlawful.
---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 15.0
To unsubscribe, send a message to [log in to unmask] with following text
in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to
[log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to
[log in to unmask]: SET Technet Digest
Search the archives of previous posts at:
http://listserv.ipc.org/archives
Please visit IPC web site
http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for
additional information, or contact Keach Sasamori at [log in to unmask] or
847-615-7100 ext.2815
-----------------------------------------------------
---------------------------------------------------------------------
This transmission (including any attachments) may contain confidential information, privileged material (including material protected by the solicitor-client or other applicable privileges), or constitute non-public information. Any use of this information by anyone other than the intended recipient is prohibited. If you have received this transmission in error, please immediately reply to the sender and delete this information from your system. Use, dissemination, distribution, or reproduction of this transmission by unintended recipients is not authorized and may be unlawful.
---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 15.0
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815
-----------------------------------------------------
|
