For the rest of us, it's possible to get a copy of Werner's article at:
http://www.globalsmt.net/index.php?option=com_content&task=view&id=33&Itemid=65
Now if only I could get him to explain it to me in small words... :-)
regards,
- Graham Collins
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Werner Engelmaier /*
Sent: Tuesday, May 19, 2009 3:18 PM
To: [log in to unmask]
Subject: Re: [TN] Underfill Pass/fail criteria
Hi Bev,
Clearly, the most important SJs that need to be covered are the outermost rows and the rows directly underneath the die outline—this later is most important for face-up BGAs and CSPs.
I do not know if one can write generally applicable pass/fail criteria [because, what else, 'It depends'].
I ave attached a column of mine on underfills [sorry for the rest of you for whom IPC strips the attachment], Engelmaier, W., “Reliability Improvement with Underfill,” Global SMT & Packaging, Vol. 6, No. 3, March 2006, pp. 66-67.
Werner
-----Original Message-----
From: Bev Christian <[log in to unmask]>
To: [log in to unmask]
Sent: Tue, 19 May 2009 1:51 pm
Subject: [TN] Underfill Pass/fail criteria
TechNetters,
I am aware of J-STd-030 "Guideline for Selection & Application of
Underfill" and the existence of IPC standards committee 5-24F "Underfill
Adhesives for Flip Chip Applications". There is nothing in IPC-A-610D
about underfills. I have taken Brian Toleno's very good course on
underfills, but on going back and looking at the CD, I don't see
anything on pass/fail criteria. Do any of you know of an international
standard (American, IEC, Japanese) with pass/fail criteria for cured
underfills?
I am particularly interested in what said standard (or anything you want
to tell me) says about coverage and voiding.
Bev
RIM
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