Hi Bev,
Clearly, the most important SJs that need to be covered are the outermost rows and the rows directly underneath the die outline—this later is most important for face-up BGAs and CSPs.
I do not know if one can write generally applicable pass/fail criteria [because, what else, 'It depends'].
I ave attached a column of mine on underfills [sorry for the rest of you for whom IPC strips the attachment], Engelmaier, W., “Reliability Improvement with Underfill,” Global SMT & Packaging, Vol. 6, No. 3, March 2006, pp. 66-67.
Werner
-----Original Message-----
From: Bev Christian <[log in to unmask]>
To: [log in to unmask]
Sent: Tue, 19 May 2009 1:51 pm
Subject: [TN] Underfill Pass/fail criteria
TechNetters,
I am aware of J-STd-030 "Guideline for Selection & Application of
Underfill" and the existence of IPC standards committee 5-24F "Underfill
Adhesives for Flip Chip Applications". There is nothing in IPC-A-610D
about underfills. I have taken Brian Toleno's very good course on
underfills, but on going back and looking at the CD, I don't see
anything on pass/fail criteria. Do any of you know of an international
standard (American, IEC, Japanese) with pass/fail criteria for cured
underfills?
I am particularly interested in what said standard (or anything you want
to tell me) says about coverage and voiding.
Bev
RIM
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