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May 2009

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Subject:
From:
Bev Christian <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Bev Christian <[log in to unmask]>
Date:
Tue, 19 May 2009 13:51:53 -0400
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TechNetters,
I am aware of J-STd-030 "Guideline for Selection & Application of
Underfill" and the existence of IPC standards committee 5-24F "Underfill
Adhesives for Flip Chip Applications".  There is nothing in IPC-A-610D
about underfills.  I have taken Brian Toleno's very good course on
underfills, but on going back and looking at the CD, I don't see
anything on pass/fail criteria.  Do any of you know of an international
standard (American, IEC, Japanese) with pass/fail criteria for cured
underfills?

I am particularly interested in what said standard (or anything you want
to tell me) says about coverage and voiding.

Bev
RIM

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