Anat,
seems as you have a bad batch of caps. Ceramic caps are very tough today and 
such failures are not very common. Guess the caps are not AVX or Murata or 
similar good brands, but a lower class cap manufacturer. Rogers RF board 
material have a rather high CTE, but despite that, the caps use to survive 
soldering. We consume millions of ceramic caps without problems, even not 
with Rogers RF boards. If you follow Werner's golden rule, meagre solder 
joints, minimal meniscus, you may get even these caps through the process. 
With tiny 0201, presume you are a 0201, fat solder joints will be like 
sitting on the B seat when flying, and have two sumo wrestlers on seat A and 
C: you'll be crushed sooner or later.

Inge


----- Original Message ----- 
From: "Anat Douek" <[log in to unmask]>
To: <[log in to unmask]>
Sent: Sunday, May 17, 2009 11:25 AM
Subject: [TN] FW: [TN] 0201 capacitor failure after reflow


> See Photo of the failed capacitor.
>
> Anat
>
>
>
>
> Hi,
> We have 8 layers RF circuit, the internal layers are FR4 and the top &
> bottom layers are ROGGERS material. The PCB pads are solder mask define.
> There are many 0201 components on this circuit without any problem,  and 
> one
> type of capacitors is rejected after the reflow process. The problem is 
> that
> the capacitors pads are separated from the body completely or there are
> cracks between the pads and the capacitor body. The pads of the capacitor
> located on the bottom and on the sides of it, there is no pads on the top 
> of
> the component. The PCB finish is immersion gold over nickel .
> The capacitor finish  is pure tin over nickel
> The solder is lead - tin paste.
>
> What can be the cause of this failure?
> Is different size of pads of the capacitor on the PCB can cause this 
> problem
> ?
>
> Anat
>
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