See Photo of the failed capacitor.

Anat




Hi,
We have 8 layers RF circuit, the internal layers are FR4 and the top &
bottom layers are ROGGERS material. The PCB pads are solder mask define.
There are many 0201 components on this circuit without any problem,  and one
type of capacitors is rejected after the reflow process. The problem is that
the capacitors pads are separated from the body completely or there are
cracks between the pads and the capacitor body. The pads of the capacitor
located on the bottom and on the sides of it, there is no pads on the top of
the component. The PCB finish is immersion gold over nickel .
The capacitor finish  is pure tin over nickel 
The solder is lead - tin paste.

What can be the cause of this failure?
Is different size of pads of the capacitor on the PCB can cause this problem
?

Anat 

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