Hi Werner,
Can you explain in more details item 1 and 2.
Regards,
Anat
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Werner Engelmaier /*
Sent: Friday, May 15, 2009 10:11 PM
To: [log in to unmask]
Subject: Re: [TN] 0201 capacitor failure after reflow
Hi Anat,
You can eliminate 3), 4) and 5) from my list, leaving1)and 2).
Werner
-----Original Message-----
From: Anat Douek <[log in to unmask]>
To: [log in to unmask]
Sent: Fri, 15 May 2009 10:47 am
Subject: Re: [TN] 0201 capacitor failure after reflow
Hi Werner,
The PCB finish is immersion gold over nickel .
The capacitor finish is pure tin over nickel The solder is lead - tin
paste.
Anat
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Werner Engelmaier /*
Sent: Thursday, May 14, 2009 11:41 PM
To: [log in to unmask]
Subject: Re: [TN] 0201 capacitor failure after reflow
Hi Anat,
I take it this is SAC solder.
From what you describe, it sounds like an overstress failure due to the
combination of:
1) large CC/PCB CTE-mismatch,
2) large solder fillets,
3) stiff SAC solder,
4) Pb-free PCB base material that is more brittle,
5) large delta-T between SAC Solidus and PCB Tg.
Werner
-----Original Message-----
From: Anat Douek <[log in to unmask]>
To: [log in to unmask]
Sent: Thu, 14 May 2009 5:18 pm
Subject: [TN] 0201 capacitor failure after reflow
Hi,
We have 8 layers RF circuit, the internal layers are FR4 and the top &
bottom layers are ROGGERS material. The PCB pads are solder mask define.
There are many 0201 components on this circuit without any problem, and one
type of capacitors is rejected after the reflow process. The problem is that
the capacitors pads are separated from the body completely or there are
cracks between the pads and the capacitor body. The pads of the capacitor
located on the bottom and on the sides of it, there is no pads on the top of
the component.
What can be the cause of this failure?
Is different size of pads of the capacitor on the PCB can cause this problem
?
Anat
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