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May 2009

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Subject:
From:
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Inge <[log in to unmask]>
Date:
Thu, 14 May 2009 22:31:07 +0200
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Anat,
send a photo to Steve Gregory so that we can see the solder meniscus and 
solder amount.
TN guru John Maxwell will solve the mystery before you say 
ubuntidiskloadingexpertisesalary
Inge

----- Original Message ----- 
From: "Anat Douek" <[log in to unmask]>
To: "'TechNet E-Mail Forum'" <[log in to unmask]>; "'Inge'" 
<[log in to unmask]>
Sent: Thursday, May 14, 2009 11:18 PM
Subject: 0201 capacitor failure after reflow


>
>
> Hi,
> We have 8 layers RF circuit, the internal layers are FR4 and the top &
> bottom layers are ROGGERS material. The PCB pads are solder mask define.
> There are many 0201 components on this circuit without any problem,  and 
> one
> type of capacitors is rejected after the reflow process. The problem is 
> that
> the capacitors pads are separated from the body completely or there are
> cracks between the pads and the capacitor body. The pads of the capacitor
> located on the bottom and on the sides of it, there is no pads on the top 
> of
> the component.
> What can be the cause of this failure?
> Is different size of pads of the capacitor on the PCB can cause this 
> problem
> ?
>
> Anat
>
>
> 

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