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May 2009

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Subject:
From:
"Stadem, Richard D." <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Stadem, Richard D.
Date:
Thu, 14 May 2009 14:14:46 -0500
Content-Type:
text/plain
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text/plain (53 lines)
http://books.google.com/books?id=wyzY9ap1SQkC&pg=PA392&lpg=PA392&dq=seam
-welding+multichip+module&source=bl&ots=us1czQT9BW&sig=-K482NZQJEIrgetub
uxdH-Vc1FA&hl=en&ei=M20MSqvSI96ptgepwombCA&sa=X&oi=book_result&ct=result
&resnum=1#PPA390,M1

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Inge
Sent: Thursday, May 14, 2009 1:39 PM
To: [log in to unmask]
Subject: [TN] Seam welding

I'm creating  instructions for design engineers, purchasers and
operators 
about seamwelding MCM packages. About AlSiC ones, electroless Nickel is 
preferred by experts around. However, I mean electrolytic Nickel minimum
5um 
is better. I have tried Sulfamate halfbright on both lid and package.
Lids 
are typically 0.5 mm thick with 12% Si added. However, I've no 
recommendations for wheel angle.Anyone who got experience? 5, 10, 15
degrees 
or what? Machine makers have nothing on AlSiC.


Inge 

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