I've read through the archives of this and other forums, also questioned
CM's and Fabricators about preferred Via soldermask features. I thought I
had resolved the issue once and for all that the best (and only reliable)
options were:

1. Conductively filled vias covered by LPI mask.
2. Partially LPI mask tented vias with via barrel exposed both sides
("encroached").

Seems there are still proponents of full LPI Via tenting without any type of
plugging.

Are there any studies with proof that a particular method of via masking
causes problems, or a method that should be the preferred practice?

Is there any IPC standard or activity to develop a standard on via masking?

Thanks,
Dave

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