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May 2009

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Subject:
From:
Vladimir Igoshev <[log in to unmask]>
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Date:
Tue, 19 May 2009 18:51:44 +0000
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Depending on the package, sometimes it's possible to C-SAM it to get an idea on the percentage.



Vladimir



SENTEC

SENTEC

11 Canadian Road, Unit 7.

Scarborough, ON M1R 5G1

Tel: (416) 899-1882

Fax: (905) 882-8812

www.sentec.ca





-----Original Message-----

From: Ioan Tempea <[log in to unmask]>



Date:         Tue, 19 May 2009 14:39:45 

To: <[log in to unmask]>

Subject: Re: [TN] Underfill Pass/fail criteria





Bev,



No answer here, but one question: how can one visualize and measure voiding in underfills?



Thanks,



Ioan Tempea, ing.

t : 450-967-7100 ext : 244

[log in to unmask]

www.digico.cc

P N'imprimer que si nécessaire - Print only if you must

-----Message d'origine-----

De : Bev Christian [mailto:[log in to unmask]] 

Envoyé : 19 mai 2009 13:52

À : [log in to unmask]

Objet : [TN] Underfill Pass/fail criteria



TechNetters,

I am aware of J-STd-030 "Guideline for Selection & Application of

Underfill" and the existence of IPC standards committee 5-24F "Underfill

Adhesives for Flip Chip Applications".  There is nothing in IPC-A-610D

about underfills.  I have taken Brian Toleno's very good course on

underfills, but on going back and looking at the CD, I don't see

anything on pass/fail criteria.  Do any of you know of an international

standard (American, IEC, Japanese) with pass/fail criteria for cured

underfills?



I am particularly interested in what said standard (or anything you want

to tell me) says about coverage and voiding.



Bev

RIM



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