Depending on the package, sometimes it's possible to C-SAM it to get an idea on the percentage.
Vladimir
SENTEC
SENTEC
11 Canadian Road, Unit 7.
Scarborough, ON M1R 5G1
Tel: (416) 899-1882
Fax: (905) 882-8812
www.sentec.ca
-----Original Message-----
From: Ioan Tempea <[log in to unmask]>
Date: Tue, 19 May 2009 14:39:45
To: <[log in to unmask]>
Subject: Re: [TN] Underfill Pass/fail criteria
Bev,
No answer here, but one question: how can one visualize and measure voiding in underfills?
Thanks,
Ioan Tempea, ing.
t : 450-967-7100 ext : 244
[log in to unmask]
www.digico.cc
P N'imprimer que si nécessaire - Print only if you must
-----Message d'origine-----
De : Bev Christian [mailto:[log in to unmask]]
Envoyé : 19 mai 2009 13:52
À : [log in to unmask]
Objet : [TN] Underfill Pass/fail criteria
TechNetters,
I am aware of J-STd-030 "Guideline for Selection & Application of
Underfill" and the existence of IPC standards committee 5-24F "Underfill
Adhesives for Flip Chip Applications". There is nothing in IPC-A-610D
about underfills. I have taken Brian Toleno's very good course on
underfills, but on going back and looking at the CD, I don't see
anything on pass/fail criteria. Do any of you know of an international
standard (American, IEC, Japanese) with pass/fail criteria for cured
underfills?
I am particularly interested in what said standard (or anything you want
to tell me) says about coverage and voiding.
Bev
RIM
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