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May 2009

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Subject:
From:
"James, Chris" <[log in to unmask]>
Reply To:
(Leadfree Electronics Assembly Forum)
Date:
Fri, 15 May 2009 09:08:35 +0100
Content-Type:
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text/plain (156 lines)
The one bag for life is rather a simplistic and naïve view; in reality many pcbs are supplied vacuum wrapped in batches of some multiple, i.e. 5, 10 etc.



Secondly if you were to consider shipping each pcb in its own bag, the volumetric (envelope) requirement for the bare pcb will be far different in most cases to that of an assembled board.



Chris





-----Original Message-----

From: Leadfree [mailto:[log in to unmask]] On Behalf Of Stadem, Richard D.

Sent: 14 May 2009 21:22

To: [log in to unmask]

Subject: Re: [LF] [TN] Bare PCB Packaging Requirements



LOL, thank you, friend Dewey. In fact, I am also a member of D-35, and I

provided quite a bit of material to the committee through John Perry

awhile back. Due to being so busy, and also because it is difficult for

me to hear very well in the teleconferences (I have a hearing

disability), I have simply been getting the draft revisions from John's

emails and getting my input back to John with an email response.



For the rest of you on the forum, I strongly suggest you read the work

this committee has done to date and provide your feedback. Read the

draft of IPC-1601 at

http://www.ipc.org/committeedetail.aspx?Committee=D-35. The inputs from

Dewey Whittaker, Dave Hillman, Sam Theabo, and many, many others are

coming together, and John is coordinating an excellent reference

standard in IPC-1601 that will help all of us.



-----Original Message-----

From: Whittaker, Dewey (EHCOE) [mailto:[log in to unmask]] 

Sent: Thursday, May 14, 2009 2:57 PM

To: TechNet E-Mail Forum; Stadem, Richard D.

Subject: RE: [TN] Bare PCB Packaging Requirements



Richard,

Excellent reply. IPC-1601 is going to start stipulating that as a best

practice with hopes that the requirements become mandatory. We would

welcome your support or views on this committee. Any person self-assured

enough to state on a public forum that he is a friend of mine, is one to

whom we should pay heed to what he says.

Dewey



-----Original Message-----

From: TechNet [mailto:[log in to unmask]] On Behalf Of Stadem, Richard D.

Sent: Thursday, May 14, 2009 12:12 PM

To: [log in to unmask]

Subject: Re: [TN] Bare PCB Packaging Requirements



1. The same moisture barrier bags that are ESD-safe Faraday bags also

work well as moisture barrier bags for shipping and storing PWBs. These

Faraday bags often work well for storage of the CCA during assembly. Why

use two different types of bags if one fits the bill? Non-ESD

polyethylene bags are notorious ESD generators. I wouldn't want them in

my factory.



2. Many CEMs and OEMs have requirements for the PWBs to be shipped in

MBBs, in order to prevent against surface finish oxidation in the case

of IAg, ISn, HASL and FTL finishes. Some invoke a requirement such as

IPC 4552 or 4553 in order to ensure the boards are dry and hermetically

sealed.



3. All PWBs absorb moisture from the air. Having the boards sealed

prevents excess moisture ingress, in some cases if the boards are

shipped in sealed bags with desiccant, the user may not need to pre-bake

if they are able to successfully perform Kanban pull from the fabricator

within a short time frame. This, of course, requires qualification and

validation of the process and procedures.



So, if a bag is required, use one from start to finish that meets

multiple requirements.



I assume you understand why moisture within the PWB is not a desirable

condition.





-----Original Message-----

From: TechNet [mailto:[log in to unmask]] On Behalf Of John Parsons

Sent: Thursday, May 14, 2009 1:37 PM

To: [log in to unmask]

Subject: [TN] Bare PCB Packaging Requirements



Tell us, how many CEM's out there are demanding that bare PCB's be

received

in vacuum sealed moisture barrier anti-static bags.  If so, what is your

reasoning?  Just to be clear my focus here is "anti-static" not the

moisture

barrier properties of the packaging.



 



Regards



 



John Parsons



 





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