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May 2009

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Subject:
Re: DesignerCouncil Digest - 30 Apr 2009 to 1 May 2009 - Special issue (#2009-83)
From:
Dave Schaefer <[log in to unmask]>
Reply To:
(Designers Council Forum)
Date:
Fri, 1 May 2009 10:14:57 -0500
Content-Type:
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Traces or vias under components without leads (qfn, discretes, etc) are not desired as they can cause problems during reflow.

If the traces are masked, the area under the component can be higher than the pad surface which can tilt the component resulting in tombstoning; if they are unmasked to prevent tilting they can result in solder shorts under the component.


> 
> From: DesignerCouncil automatic digest system <[log in to unmask]>
> Date: 2009/05/01 Fri AM 10:03:29 CDT
> To: [log in to unmask]
> Subject: DesignerCouncil Digest - 30 Apr 2009 to 1 May 2009 - Special issue (#2009-83)
> 
> 

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