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Lenny
I would suggest a different non-chemical approach by freezing the ballast
and then chipping or cutting the frozen pitch material to get to the surface
for Failure Analysis. We have found that pitch can be contaminated and
cause leakage and corrosion problems. We have also found that capacitors can
leak and the electrolyte will dissolve the material and cause leakage and
corrosion problems. If you have solder joint problems then this approach
works well to investigate the joint quality as well. If you have an question
please call.
Terry Munson
765-457-8095
In a message dated 5/29/2009 2:01:42 P.M. Eastern Daylight Time,
[log in to unmask] writes:
We have a lighting ballast in for failure analysis and arent sure how to
get the encapsulant "tar" from it?
This is a lighting ballast and we have the metal covers removed and are
left with a ballast assy built on a pcb, and covered in a thick, black,
semi-pliable, tar-like encapsulant.
The tar-like encapsualant smells just like roofing tar. If you lay it on
a piece of notepaper it stains it just like roofing tar. It can be peeled
away just like a roofing tar. We are afraid of poking too much and
damaging components or circuits. Anybody have experience with it? - and know
what it is? and how to let it soak in a pan of something and rinse this stuff
of instead? Better ideas?
Thanks in advance,
Lenny Carter
Design Engineer
ERG, Inc.
ph (607) 754-9187 x3063
www.ergpower.com
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