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May 2009

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Wed, 20 May 2009 08:06:09 -0300
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TechNet E-Mail Forum <[log in to unmask]>, [log in to unmask]
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Graham Collins <[log in to unmask]>
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Well, if I knew I was not clear on it does that make me just half dumb, or full dumb???  Dewey, cut me some slack!!!



 



Thanks Werner.



 



regards, 

 - Graham 



From: [log in to unmask] [mailto:[log in to unmask]] 

Sent: Tuesday, May 19, 2009 4:29 PM

To: Collins, Graham (FN) @ ESI; [log in to unmask]

Subject: Re: [TN] Underfill Pass/fail criteria



 



Hi Graham,

You are reading it incorrectly.



If you compare the results in Fig. 2 with those in Figs. 3 and 4, it is clear that snap-curing underfill give better fatigue life improvements [do not ask me why, I don't know].

Werner



 



-----Original Message-----

From: [log in to unmask]

To: [log in to unmask]; [log in to unmask]

Sent: Tue, 19 May 2009 3:17 pm

Subject: RE: [TN] Underfill Pass/fail criteria



Werner, my apologies - if I have offended it was not intended – where meaning has not been understood the fault is mine.  Well, that and plus that just as I think I’m understanding the intent of what you’ve written, someone rushes into my cube and distracts me with an inane fact.



 



The one thing I’m not clear on – you seem to be saying tha t slow curing resins give a better fatigue life, but that this doesn’t translate into real-world reliability improvement?  Or am I reading it incorrectly?



 



regards, 

 - Graham Collins



 



From: [log in to unmask] <mailto:[log in to unmask]>  [mailto:[log in to unmask] <mailto:[log in to unmask]> ] 

Sent: Tuesday, May 19, 2009 4:01 PM

To: [log in to unmask] <mailto:[log in to unmask]> ; Collins, Graham (FN) @ ESI

Subject: Re: [TN] Underfill Pass/fail criteria



 



Hi Graham,

The English language is wonderfully adapt to explain things—that is why it has displaced French as the language of diplo macy and German as the language of technology—it is now a great lingua franca.

I try [nobody is perfect, as my wife reminds me all the time], but sometimes I do not succeed in conveying the meaning properly.

What do I need to clarify, if not to say dumb down?

Werner



 



 



-----Original Message-----

From: Graham Collins <[log in to unmask] <mailto:[log in to unmask]> >

To: [log in to unmask] <mailto:[log in to unmask]> 

Sent: Tue, 19 May 2009 2:31 pm

Subject: Re: [TN] Underfill Pass/fail criteria



For the rest of us, it's possible to get a copy of Werner's article at:







































http://www.globalsmt.net/index.php?option=com_content&task=view&id=33&Itemid=65 <http://www.globalsmt.net/index.php?option=com_content&task=view&id=33&Itemid=65> 















































































Now if only I could get him to explain it to me in small words...  :-)















































































regards,







































 - Graham Collins















































































-----Original Message-----







































From: TechNet [mailto:[log in to unmask] <mailto:[log in to unmask]> ] On Behalf Of Werner Engelmaier /*







































Sent: Tuesday, May 19, 2009 3:18 PM







































To: [log in to unmask] <mailto:[log in to unmask]> 







































Subject: Re: [TN] Underfill Pass/fail criteria























































































































 Hi Bev,







































Clearly, the most important SJs that need to be covered are the outermost rows 







































and the rows directly underneath the die outline—this later is most important 







































for face-up BGAs and CSPs.













=0

A



















I do not know if one can write generally applicable pass/fail criteria [because, 







































what else, 'It depends'].







































I ave attached a column of mine on underfills [sorry for the rest of you for 







































whom IPC strips the attachment], Engelmaier, W., “Reliability Improvement with 







































Underfill,” Global SMT & Packaging, Vol. 6, No. 3, March202006, pp. 66-67. 







































Werner























































































































 























































































































 















































































-----Original Message-----







































From: Bev Christian <[log in to unmask] <mailto:[log in to unmask]> >







































To: [log in to unmask] <mailto:[log in to unmask]> 







































Sent: Tue, 19 May 2009 1:51 pm







































Subject: [TN] Underfill Pass/fail criteria























































































































































































































































































































































































































































TechNetters,







































I am aware of J-STd-030 "Guideline for Selection & Application of







































Underfill" and the existence of IPC standards committee 5-24F "Underfill







































Adhesives for Flip Chip Applications".  There is nothing in IPC-A-610D







































about underfills.  I have taken Brian Toleno's very good course on







































underfills, but on going back and looking at the CD, I don't see







































anything on pass/fail criteria.  Do any of you know of an international







































standard (American, IEC, Japanese) with pass/fail criteria for cured







































unde

rfills?















































































I am particularly interested in what said standard (or anything you want







































to tell me) says about coverage and voiding.















































































Bev







































RIM















































































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