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Tue, 19 May 2009 16:54:41 -0500 |
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Hi Bev - I don't know of any industry requirements but I do have an
internal standard developed based on discussions with Brian T, other
industry material suppliers and test data. We can discuss when I see ya at
the SMTA Toronto conference this week if you want. None of the
"requirements" are rocket science and some of it is based on
qualified/demonstrated process control.
Dave Hillman
Rockwell Collins
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Bev Christian <[log in to unmask]>
Sent by: TechNet <[log in to unmask]>
05/19/2009 12:51 PM
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TechNet E-Mail Forum <[log in to unmask]>; Please respond to
Bev Christian <[log in to unmask]>
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Subject
[TN] Underfill Pass/fail criteria
TechNetters,
I am aware of J-STd-030 "Guideline for Selection & Application of
Underfill" and the existence of IPC standards committee 5-24F "Underfill
Adhesives for Flip Chip Applications". There is nothing in IPC-A-610D
about underfills. I have taken Brian Toleno's very good course on
underfills, but on going back and looking at the CD, I don't see
anything on pass/fail criteria. Do any of you know of an international
standard (American, IEC, Japanese) with pass/fail criteria for cured
underfills?
I am particularly interested in what said standard (or anything you want
to tell me) says about coverage and voiding.
Bev
RIM
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