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April 2009

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Subject:
From:
bob wettermann <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, bob wettermann <[log in to unmask]>
Date:
Fri, 10 Apr 2009 08:16:13 -0700
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Thanks all to have responded.

More options came up yesterday in speaking with other suppliers of the 1oz base copper material. There are versions which have :

1. 8-10 microns roughness on one side (this will be electroplated with 1-1.4 microns of tin)

2. 0.3-0.4 microns roughness on the other side (this too will be electroplated with 1-1.4 microns of tin)

So now my question for you metalurgists out there is the same .....if I bond at room temp for room temp use using a 2-part epoxy SIDE 1 described above to the FR4 should I expect adequate adhesive strength (compared to a 1oz copper trace/pad run through an initial mfg process)?

Happy Easter

 Bob Wettermann
PH 847-767-5745




________________________________
From: Richard Stadem <[log in to unmask]>
To: [log in to unmask]
Sent: Friday, April 10, 2009 8:58:26 AM
Subject: Re: [TN] Friday Theorizing

As I stated in my earlier posting, there are certain epoxies that bond well to 
tin-plated copper. One that I described was pull-tested to 18 lbs before it 
pulled the foil away from the PWB. On the side where the same epoxy was 
used to bond the plated foil to the PWB, parts of the FR-4 substrate came up 
with it.
Of course, this has to be done after reflow.

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