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April 2009

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Subject:
From:
R Sedlak <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, R Sedlak <[log in to unmask]>
Date:
Thu, 9 Apr 2009 12:05:43 -0700
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Bob:  Remember there is no such thing as an oxide-free Tin surface, that is more than a few seconds old, and the older the surface, the thicker the oxide.  I suspect strongly that bond strength is going to very related to oxide thickness, no matter the adhesive composition.
It might even be worth considering some sort of oxide removal, even abrasive, before applying adhesive.
Rudy Sedlak
RD Chemical Company

--- On Thu, 4/9/09, bob wettermann <[log in to unmask]> wrote:

From: bob wettermann <[log in to unmask]>
Subject: [TN] Friday Theorizing
To: [log in to unmask]
Date: Thursday, April 9, 2009, 8:17 AM

Dear Technetters:

Has anyone done any adhesion testing of a 2um tin-electrocoated surface (copper carrier) to FR-4? How about a 0.100um tin electrocoated surface? Can someone theorize on which might give better adhesion using a 2-part epoxy?

Regards

 Bob Wettermann
BEST
PH 847-767-5745

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