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April 2009

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Subject:
From:
bob wettermann <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, bob wettermann <[log in to unmask]>
Date:
Thu, 9 Apr 2009 10:08:15 -0700
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The copper is 1 oz copper used in PCB fab. The tin is plated onto both sides.

The adhesive system is a 2part epoxy-resin system (Loctite). 

I am trying to precict which system will provide better adhesion???

Thanks

 Bob Wettermann
PH 847-767-5745




________________________________
From: Inge <[log in to unmask]>
To: [log in to unmask]
Sent: Thursday, April 9, 2009 11:15:28 AM
Subject: Re: [TN] Friday Theorizing

The correct name of  the (vintage) machine is Sebastian stud tester. It's probably followed by a number of more modern ones. From Dage, for instance.
Inge


----- Original Message ----- From: "Inge" <[log in to unmask]>
To: <[log in to unmask]>
Sent: Thursday, April 09, 2009 6:01 PM
Subject: Re: [TN] Friday Theorizing


> Bob,
> 
> why so thin Tin?  And no barrier? What's the purpose? And what do you mean with a 'carrier' ?
> When testing conductor adhesion, we simple make a board sample with a number of copper traces, then cut it so we get a large number of square pieces approx. 1x1 inch. Next, we apply a solder paste dot on the center of each square, size about 2 mm. This is followed by soldering kind of needles with a round plate to each square sample. Vapour phase or oven soldered. Finally, the samples are placed in a Sebastian pulling machine's chuck and depress 'pull'. The machine increases the pull force until the plate headed needle separates from the FR4 matrix and the value is presented on the display. Years ago, we did this test frequently on board coupons, but there is little interest in doing it today, because adhesion problems are very rare.
> 
> Inge
> 
> 
> ----- Original Message ----- From: "bob wettermann" <[log in to unmask]>
> To: <[log in to unmask]>
> Sent: Thursday, April 09, 2009 5:17 PM
> Subject: [TN] Friday Theorizing
> 
> 
>> Dear Technetters:
>> 
>> Has anyone done any adhesion testing of a 2um tin-electrocoated surface (copper carrier) to FR-4? How about a 0.100um tin electrocoated surface? Can someone theorize on which might give better adhesion using a 2-part epoxy?
>> 
>> Regards
>> 
>> Bob Wettermann
>> BEST
>> PH 847-767-5745
>> 
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