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April 2009

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TechNet E-Mail Forum <[log in to unmask]>, Inge <[log in to unmask]>
Date:
Thu, 9 Apr 2009 18:15:28 +0200
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The correct name of  the (vintage) machine is Sebastian stud tester. It's 
probably followed by a number of more modern ones. From Dage, for instance.
Inge


----- Original Message ----- 
From: "Inge" <[log in to unmask]>
To: <[log in to unmask]>
Sent: Thursday, April 09, 2009 6:01 PM
Subject: Re: [TN] Friday Theorizing


> Bob,
>
> why so thin Tin?  And no barrier? What's the purpose? And what do you mean 
> with a 'carrier' ?
> When testing conductor adhesion, we simple make a board sample with a 
> number of copper traces, then cut it so we get a large number of square 
> pieces approx. 1x1 inch. Next, we apply a solder paste dot on the center 
> of each square, size about 2 mm. This is followed by soldering kind of 
> needles with a round plate to each square sample. Vapour phase or oven 
> soldered. Finally, the samples are placed in a Sebastian pulling machine's 
> chuck and depress 'pull'. The machine increases the pull force until the 
> plate headed needle separates from the FR4 matrix and the value is 
> presented on the display. Years ago, we did this test frequently on board 
> coupons, but there is little interest in doing it today, because adhesion 
> problems are very rare.
>
> Inge
>
>
> ----- Original Message ----- 
> From: "bob wettermann" <[log in to unmask]>
> To: <[log in to unmask]>
> Sent: Thursday, April 09, 2009 5:17 PM
> Subject: [TN] Friday Theorizing
>
>
>> Dear Technetters:
>>
>> Has anyone done any adhesion testing of a 2um tin-electrocoated surface 
>> (copper carrier) to FR-4? How about a 0.100um tin electrocoated surface? 
>> Can someone theorize on which might give better adhesion using a 2-part 
>> epoxy?
>>
>> Regards
>>
>> Bob Wettermann
>> BEST
>> PH 847-767-5745
>>
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