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April 2009

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Subject:
From:
Dwight Mattix <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Dwight Mattix <[log in to unmask]>
Date:
Mon, 6 Apr 2009 06:41:41 -0700
Content-Type:
text/plain
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text/plain (67 lines)
There's always two conversations going on in these matters. Be 
careful not to mix them too soon.

One is technical/scientific. The other is about business/financial 
responsibility. Don't start the second conversation prematurely.

First things first. Answer first question while keeping your 
technical hat firmly in place -- before going on to discuss second matter.

Have you (or the customer) done a failure analysis yet?  Have you 
been able to isolate on the failure and categorize the failure mode(s)?

The second matter is more difficult.

Been there. Done that. Got the tee-shirt. Weekly.  :-)

Good luck.

At 10:05 PM 4/5/2009, mp3 wrote:
>Hello,
>
>One of our customers have comeback after 3 years asking for a 
>failure analysis report on a 10 layer industrial grade PCB. The PCB 
>was supplied 3 years back and has been functioning satisfactorilly 
>for the last 3 years. Now the customer has 3 PCBs which have failed 
>and is insisting it is a PCB related failure. The failure in all the 
>3 circuit boards are in the same area around a quadpack IC. We 
>verified the traveller card of the boards processed and found all 
>aspects to be compliant. The PCBs were being used in a jig for high 
>reliability harness checking. We feel it should be a component 
>related issue rather than a PCB related issue.
>
>Can you give us some inputs on the above which will help us in 
>arriving at the right conclusion.
>
>Rgds
>
>Pradeep
>
>-------------------------------
>Micropack Ltd, Bangalore, India
>
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