Hi Jim,

Just having issues trying to find the right balance between the thermal
pad and I/O pad opening dimensions in the stencil. We're about to go on
our third stencil iteration and have a good idea what we're going to do,
but it's frustrating when you follow the design guidelines that the
manufacturer of the device say to do, and they don't work.

But why should I be surprised at that? Sheesh...

Just wondering if others go through this drill too?

Steve 

-----Original Message-----
From: Jim Wolvansky [mailto:[log in to unmask]] 
Sent: Wednesday, April 29, 2009 12:23 PM
To: Steve Gregory
Subject: RE: [TN] Actel QFN180 Assembly

Hello, Steve.

I've got some experience with devices like these, what issues are you
having?

 - Jim

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Steve Gregory
Sent: Wednesday, April 29, 2009 9:11 AM
To: [log in to unmask]
Subject: [TN] Actel QFN180 Assembly

Hi All,
 
We just ran a board with an Actel QFN180 device, and followed the
stencil guidelines recommended by Actel in their publication:
 
http://www.actel.com/documents/QFN_AN.pdf
 
but we have had our issues.
 
I was wondering if anyone else has used this component and would be
willing to share their experience with it.
 
We'll figure out things eventually, but I figure it wouldn't hurt to ask
for some advice from this wonderful group.
 
Thanks,
 
Steve

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