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April 2009

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Subject:
From:
"Whittaker, Dewey (EHCOE)" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Whittaker, Dewey (EHCOE)
Date:
Mon, 27 Apr 2009 10:50:47 -0700
Content-Type:
text/plain
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text/plain (91 lines)
Kevin,
I wouldn't send him a link over there; it may bring out the wurst in
him. A less sensitive person may have inferred that he didn't know beans
about the subject, but I won't even though he offered my wife
condolences at IPC EXPO for having to put up with my lame jokes.
Dewey

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Werner Engelmaier /*
Sent: Monday, April 27, 2009 10:16 AM
To: [log in to unmask]
Subject: Re: [TN] solder fatigue analysis for slowly changing thermal
environment


 Hi Kevin,
Have passport, will travel-I need a passport to Boston since currently I
am in Vienna.
All I need to go anywhere is a proper invitation-in many places
companies make internal arrangements for workshops, but invite outsiders
into their conference facilities to spread the costs around. This is
particularly important nowadays, since many organizations, like IPC,
have canceled all but their main conferences. So industry needs to take
things into their own hands and organize workshop presentations; of
course, I will help.

Werner


 


 

-----Original Message-----
From: Kevin Glidden <[log in to unmask]>
To: [log in to unmask]; Werner Engelmaier /* <[log in to unmask]>
Sent: Mon, 27 Apr 2009 9:10 am
Subject: Re: solder fatigue analysis for slowly changing thermal
environment










Hi Werner,
How did I know that would be the answer?!  Have you posted an updated 
schedule for 2009?   Any plans to hit the Northeast (Boston)?  All that
time in 
Moscow and Rumania, but here in the US you hit Orlando, Dallas, and Las 
Vegas!  Put on the ushanka and come North! ;)





 


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